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外刊文摘
• Create high-quality program for at-speed test
• Intel publishes papers on future programmable multicores
• TI acquires RF IC design specialist
• Sony sets up US electronics recycling program
• Apple designs impact global chip supply chain
• Intel moves embedded NOR products to 65nm
• Infineon preps power semi JV with Siemens
• China pure-audio MP3 sales drop to half in 1H07
• Dull cellphone designs bog down Motorola
• Nokia achieves 17 percent market share in WCDMA handsets
• John G. Waclawsky Appointed Motorola Software Architect
• Global firms Samsung and Philips say Singapore can do more in R&
• BenQ Q2 profit slumps, cautious optimism on Q3
• Sony Ericsson To Incorporate Push-To-Talk from Kodia Into Mobile
• TTPCom chooses Freescale RF for CBEmacro platform
• Competitive Alert (JUL 5--Aug 5)
• Nokia bags GSM order from India''s Bharti
• Samsung Launches Two Symbian Smartphones for Europe
• SanDisk Launches ''Digital Backpack'' USB Flash Drive
• Melding of cell phones and Wi-Fi will be cosmic, man
• What drives mobile communications systems beyond 3G? Find out in
• China seen issuing 4 3G licenses this year
• Motorola Phones Let Parents Monitor Kids
• Japan, China to jointly develop next-generation cellular phones
• Motorola may manufacture mobile phones in India
• Nokia sees 200 mln new China mobile users in 3 yrs
• Intel, Micron team to make flash memory
• Apple aids $5 billion Intel, Micron flash venture
• Chain debugger said to cut circuit debug, test times
• Samsung may dull Motorola''s Razr edge
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