China fabs accounted for 12% of global market in 2006》及本站其它信息均来自网络!
行业新闻技术文章解决方案电路图产品库厂商库供应信息求购信息外刊文摘
 技术文章 -> PCB电源单片机DSP设备与仪器EDA放大/转换存储器嵌入式接口与连接通讯与网络模拟技术其它技术文章
 解决方案 -> 汽车电子光电与显示测试测量计算机与外设仪器仪表通讯与网络视像设备消费电子工业控制其它解决方案
 产 品 库 -> 存储器嵌入式单片机电源通讯网络接口电路DSP视频音频EDA/PLD显示光电电测仪表传感与控制其它产品
 首页 -> 外刊文摘 -> 正文

China fabs accounted for 12% of global market in 2006

A recent CCID Consulting report forecasts that the global foundry market and industry will continue to grow rapidly and is expected to hit a CAGR of 11.7 percent in the next five years. Sales revenues of China foundries, meanwhile, are predicted to grow at a CAGR of 17.9 percent, reaching $6.53 billion by 2011 and accounting for 15.9 percent of the global market then.

The China foundry industry traces its beginnings back to the establishment of CSMC-HJ (now CSMC) in the 1990s. However, the market only achieved major growth when a number of foundries including SMIC and Grace Semiconductor started operating in 2001. Statistics show that from 2002 to 2006, sales revenues of China foundries expanded 6.8 times, with a CAGR of 67.2 percent. In 2006, the industry reached a size of $2.9 billion, accounting for 12 percent of the global market.

While sales revenues expanded fast, China’s foundry production capacity grew even faster. Between 2002 and 2006, the country saw its foundry production capacity expand 1.5 times, reaching 7.17 million pieces/year, accounting for 27.2 percent of the global production capacity.

In terms of wafer size and line width, foundry production capacity in China is still dominated by 6- and 8-inch and 0.35祄 to 0.11祄 processors. In 2006, 8-inch wafers and 0.35祄 to 0.11祄 processors, respectively, accounted for 53 percent and 55.7 percent of China’s overall foundry production capacity. The 12-inch and 90nm processors only accounted for 4 percent and 2.5 percent of the overall production capacity, respectively.

(()
Google
 >> 最近更新
 • IBM researchers drive SRAM speed to 6GHz
 • China mobile TV spec gains strong backers
 • Intel joins OLPC project
 • China MII releases 3G videophone standard
 • Startup brews ’perfect storm’ for R&D(英)
 • ADI, TSMC bring 65nm tech into baseband proc
 • Othello chip suits 3G TD-SCDMA wireless hand
 • ADI, TSMC bring 65nm tech into baseband proc
 • IEEE 802.20 working group revises voting pro
 • Sony in new power pack recall
 • IEEE plots road map for 40/100Gbps Ethernet
 • TI, Ericsson develop solutions for Open OS 3
 • China PV maker doubles production capacity
 • China offers 3G licences in exchange for tel
 • China fabs accounted for 12% of global marke
 • Intel Goes Global with WiMax
 • Icera rolls out DXP-based 3G processor
 • M-Systems acquires smart card company
 • Freescale, Chips&Media team for mobile TV
 • Cell processor to support Linux
Copyright © 2005-2008 555DZ.com 联系站长:55dz@163.com