Heard on the Beat: Intel inside F1?》及本站其它信息均来自网络!
行业新闻技术文章解决方案电路图产品库厂商库供应信息求购信息外刊文摘
 技术文章 -> PCB电源单片机DSP设备与仪器EDA放大/转换存储器嵌入式接口与连接通讯与网络模拟技术其它技术文章
 解决方案 -> 汽车电子光电与显示测试测量计算机与外设仪器仪表通讯与网络视像设备消费电子工业控制其它解决方案
 产 品 库 -> 存储器嵌入式单片机电源通讯网络接口电路DSP视频音频EDA/PLD显示光电电测仪表传感与控制其它产品
 首页 -> 外刊文摘 -> 正文

Heard on the Beat: Intel inside F1?

LONDON — Could Intel Corp. be about to take on the sponsorship of a Formula 1 Grand Prix motor racing team?

I have heard that both the McLaren and BAR teams are courting Intel. Such a move might make some sense for Intel. The demographic subset of the population that is impressed by the crazy driving of motor cars at very high speed often overlaps with the demographic subset that is extremely technofile and buys every new gadget and widget and is prepared to pay a premium price.

There’s nothing like being able to say you were the first on your block to have a GPS-enabled toothbrush.

And with Intel wanting to get recognition in consumer electronics and F1 racing being notoriously dependent on technology maybe a blurred rendition of “Intel Inside” would set the right mood.

However, it would be more Intel’s style to sponsor the whole grand prix series rather than a single puny motor racing team. That way your team wins every race.

And Intel should be warned there are perils to motorsport sponsorship other than the negative perceptions created by backing the wrong racing team, as Infineon Technologies AG has been finding out.

(()
Google
 >> 最近更新
 • Mobile phone makers to stay in-house, says i
 • Philips takes charge on mobile display merge
 • Heard on the Beat: Intel inside F1?
 • New Venture Holdings Announces New Name: Cad
 • iPod nano - Apple gets on the case
 • Qualcomm says it won''t rock 3G boat
 • China''s Huawei also gets VimpelCom''s offer
 • A million-dollar arm--no kidding
 • Ciranova plans to donate p-cell tech to Si2
 • Intel, AMD respin server chips for virtualiz
 • China digital STB maker picks Freescale sili
 • Intel invests $218.5 in virtualization solut
 • Microsoft cooks up ’smaller, quieter’ Xbox
 • IBM researchers drive SRAM speed to 6GHz
 • China mobile TV spec gains strong backers
 • Intel joins OLPC project
 • China MII releases 3G videophone standard
 • Startup brews ’perfect storm’ for R&D(英)
 • ADI, TSMC bring 65nm tech into baseband proc
 • Othello chip suits 3G TD-SCDMA wireless hand
Copyright © 2005-2008 555DZ.com 联系站长:55dz@163.com